The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Jan. 05, 2021
Lockheed Martin Corporation, Bethesda, MD (US);
Thomas Henry Hand, Highlands Ranch, CO (US);
Joshua David Gustafson, Castle Rock, CO (US);
Aaron Christopher Rothlisberger, Littleton, CO (US);
LOCKHEED MARTIN CORPORATION, Bethesda, MD (US);
Abstract
Distributed gain equalization circuits for use with radio frequency (RF) devices are provided. The distributed gain equalization circuits include a substrate layer, multiple transverse electromagnetic (TEM) line circuits disposed on the substrate layer and multiple traces disposed on the substrate layer, each trace connected to one or more of the TEM line circuits. The traces and TEM line circuits are configured to provide resistances, inductances and capacitances to eliminate the need for lumped or packaged resistors, inductors and capacitors. The distributed gain equalization circuit operates at millimeter wave frequencies and provides a compensating gain slope to counteract a negative gain slope of the RF device. Methods of manufacturing distributed gain equalization circuits are also provided.