The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
May. 02, 2022
Applicant:
Aeva, Inc., Mountain View, CA (US);
Inventors:
Zhizhong Tang, San Carlos, CA (US);
Pradeep Srinivasan, Fremont, CA (US);
Kevin Masuda, Alhambra, CA (US);
Wenjing Liang, San Jose, CA (US);
Assignee:
Aeva, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/40 (2006.01); B23K 101/40 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0237 (2021.01); B23K 1/0056 (2013.01); H01S 5/4025 (2013.01); B23K 2101/40 (2018.08);
Abstract
Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes 'selective' intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.