The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jan. 15, 2021
Applicants:

Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Satoshi Hamaoka, Kariya, JP;

Taku Inoue, Kariya, JP;

Shimpei Mune, Kariya, JP;

Hiromi Ueda, Kariya, JP;

Junichi Iida, Kariya, JP;

Satoshi Morioka, Okazaki, JP;

Motoyoshi Okumura, Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 50/183 (2021.01); H01M 4/70 (2006.01); H01M 10/0585 (2010.01); H01M 4/66 (2006.01);
U.S. Cl.
CPC ...
H01M 10/0418 (2013.01); H01M 4/66 (2013.01); H01M 4/70 (2013.01); H01M 10/0585 (2013.01); H01M 50/183 (2021.01);
Abstract

A power storage device includes a power storage module, a conductive plate, and a sealing member. The power storage module includes an electrode laminate and a sealing body. The sealing body includes a plurality of resin portions. Metal plates at laminate ends of the electrode laminate each have an exposed surface exposed from the resin portion. The exposed surface includes a contact region and a non-contact region. The sealing member includes a first sealing portion. The first sealing portion is provided along an inner edge of the resin portion to be in contact with the resin portion. The first sealing portion adheres to the conductive plate and the non-contact region and fills a portion between the conductive plate and the non-contact region. The first sealing portion seals a portion between the conductive plate and the exposed surface.


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