The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Dec. 21, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Takamasa Sunda, Tokushima, JP;

Hitoshi Nagai, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/10 (2010.01); H01L 33/24 (2010.01); H01L 33/32 (2010.01); H01L 27/15 (2006.01); H01L 33/46 (2010.01); H01L 33/60 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/10 (2013.01); H01L 27/153 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/60 (2013.01);
Abstract

A light emitting element includes: a substrate including a first surface including a first region and a second region; a first semiconductor layered body on the first region, the first semiconductor layered body comprising a first light emitting layer and including: a first lateral surface, and a second lateral surface opposite to the first lateral surface; and a second semiconductor layered body on the second region, the second semiconductor layered body comprising a second light emitting layer and including: a first lateral surface facing the second lateral surface and located on a first semiconductor layered body side of the second semiconductor layered body, and a second lateral surface opposite to the first lateral surface and located on a side opposite the first semiconductor layered body side of the second semiconductor layered body.


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