The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jun. 15, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Manabu Takakuwa, Tsu, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G01B 11/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/682 (2013.01); G01B 11/002 (2013.01); H01L 21/67248 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01);
Abstract

According to one embodiment, a position measuring apparatus includes a substrate holding part, a projection part, a liquid supply part, an imaging part, a position measuring part, and a control unit. The substrate holding part is configured to hold a substrate including at least part of a circuit pattern. The projection part is configured to irradiate the substrate held on the substrate holding part with illumination light, and to transmit reflected light from the substrate, of the illumination light radiated on the substrate. The liquid supply part is configured to supply a liquid into a space between the substrate held on the substrate holding part and the projection part. The imaging part is configured to receive the reflected light transmitted through the projection part, and to generate an image signal based on the reflected light. The position measuring part is configured to obtain positional information on a position of the substrate holding part. The control unit is configured to determine a coordinate position of the at least part of a circuit pattern in the substrate, on a basis of the positional information and the image signal.


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