The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jun. 29, 2021
Applicant:

Nuintek CO Ltd, Chungcheongnam-do, KR;

Inventors:

Dae-Jin Park, Chungcheongnam-do, KR;

Ying-Won Jeon, Chungcheongnam-do, KR;

Jin-A Park, Chungcheongnam-do, KR;

Hyeon-Jin Kim, Chungcheongnam-do, KR;

Taek-Hyeon Lee, Chungcheongnam-do, KR;

Assignee:

NUINTEK CO LTD, Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 2/08 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 2/08 (2013.01);
Abstract

The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.


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