The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Apr. 22, 2022
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Daniel J. Hiemstra, San Francisco, CA (US);

George Ho Yin Mak, Fremont, CA (US);

Ehsan Khajeh, Los Gatos, CA (US);

Camille L. Everhart, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); G06F 3/041 (2006.01); G06F 3/043 (2006.01); G10K 11/02 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1306 (2022.01); G06F 3/0412 (2013.01); G06F 3/0436 (2013.01); G10K 11/02 (2013.01);
Abstract

Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.


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