The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Nov. 09, 2020
Canon Kabushiki Kaisha, Tokyo, JP;
Ryo Nawata, Tokyo, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
An imprinting apparatus which is advantageous in improving the overlay accuracy in a shot located on an outer circumference of a substrate is provided. An imprinting apparatus which forms a pattern of an imprint material above a shot region of a substrate by performing alignment between each shot region of the substrate and a mold using a plurality of marks provided in each shot region of the substrate and a plurality of marks on the mold includes: a detection unit configured to detect at least a plurality of marks on the substrate in each shot region; and a control unit configured to use a first mark which is closest to a center of the substrate, a second mark which is arranged in a direction of a first axis along one side of the shot region with respect to the first mark, and a third mark which is arranged in a direction of a second axis perpendicular to the first axis with respect to the first mark for the alignment in each shot region, wherein the control unit uses, as the second mark, a mark which is arranged at a position closet to the center of the substrate in the shot region than that in a case in which the shot region is not located on the outer circumferential portion of the substrate when a shot region which is located on an outer circumferential portion of the substrate and whose center is located within the range of ±45° from the first axis is subjected to the alignment, and the control unit uses, as the third mark, a mark which is arranged at a position closer to the center of the substrate in the shot region than that in a case in which the shot region is not located on the outer circumferential portion of the substrate when a shot region which is located on the outer circumferential portion of the substrate and whose center is located within the range of ±45° from the second axis is subjected to the alignment.