The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Mar. 27, 2019
Midori Anzen Co., Ltd., Tokyo, JP;
Norihide Enomoto, Tokyo, JP;
Taichi Ogawa, Tokyo, JP;
Kaname Shibata, Tokyo, JP;
Junji Shibasaki, Tokyo, JP;
Midori Anzen Co., Ltd., Tokyo, JP;
Abstract
Provided is a dip molding composition including, at least: an elastomer that contains a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit, and a butadiene-derived structural unit in a polymer main chain; an epoxy crosslinking agent; water; and a pH modifier, in which dip molding composition the elastomer contains the (meth)acrylonitrile-derived structural unit in an amount of 20 to 40% by weight, the unsaturated carboxylic acid-derived structural unit in an amount of 1 to 10% by weight, and the butadiene-derived structural unit in an amount of 50 to 75% by weight, and the epoxy crosslinking agent includes an epoxy crosslinking agent containing an epoxy compound having three or more epoxy groups in one molecule and has a dissolution rate in water of 10 to 70% as determined by a specific measurement method.