The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Apr. 04, 2019
Applicant:

Corning Laser Technologies Gmbh, Krailling, DE;

Inventor:

Rico Bohme, Rochlitz, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/04 (2006.01); B23K 26/40 (2014.01); C03B 33/02 (2006.01); C03B 33/09 (2006.01); B23K 26/38 (2014.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); B23K 103/00 (2006.01); C03B 33/08 (2006.01); C03B 25/02 (2006.01);
U.S. Cl.
CPC ...
C03B 33/04 (2013.01); B23K 26/0006 (2013.01); B23K 26/38 (2013.01); B23K 26/40 (2013.01); B23K 26/53 (2015.10); C03B 33/0222 (2013.01); C03B 33/091 (2013.01); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); C03B 25/025 (2013.01); C03B 33/082 (2013.01);
Abstract

A device for producing and removing an internal contour from a planar substrate comprising: a beam-producing- and beam-forming arrangement which is configured to perform: a contour definition step wherein a laser beam is guided over the substrate to produce a plurality of individual zones of internal damage in a substrate material along a contour line defining the internal contour; a crack deformation step, wherein the laser beam is guided over the substrate and produces a plurality of individual zones of internal damage in the substrate material to form a plurality of crack line portions that lead away from the contour line into the internal contour; and a material removal-step, wherein a laser beam directed towards the substrate surface that inscribes a removal line through a thickness of the substrate at the internal contour causes the internal contour to detach from the substrate.


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