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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11713171 B1

PDFFull Text
Date of Patent:
Aug. 01, 2023

Filed:

Sep. 03, 2020

Thermoformable multilayer films and blister packs produced therefrom

Applicant:

Philip Morris Usa Inc., Richmond, VA (US);

Inventors:

Stephen J. Bellamah, Midlothian, VA (US);

Ed Carmines, Midlothian, VA (US);

Rangaraj S. Sundar, Richmond, VA (US);

Assignee:

Philip Morris USA Inc., Richmond, VA (US);

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

James C Yager

Int. Cl.
CPC ...
B65D 65/40 (2006.01); B29C 48/21 (2019.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B65D 75/32 (2006.01); B32B 27/40 (2006.01); B32B 27/30 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); B32B 27/10 (2006.01); B32B 15/20 (2006.01); B32B 3/28 (2006.01); B32B 7/05 (2019.01); B32B 27/34 (2006.01); B65D 75/36 (2006.01); B05D 7/00 (2006.01); C23C 18/16 (2006.01); C25D 7/06 (2006.01); A61J 1/03 (2023.01); B29K 23/00 (2006.01); B29K 27/06 (2006.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B05D 7/56 (2013.01); B29C 48/21 (2019.02); B32B 3/28 (2013.01); B32B 7/05 (2019.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/325 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B65D 75/327 (2013.01); B65D 75/367 (2013.01); C23C 18/1633 (2013.01); C25D 7/0614 (2013.01); A61J 1/035 (2013.01); B29K 2023/12 (2013.01); B29K 2023/38 (2013.01); B29K 2027/06 (2013.01); B29K 2067/003 (2013.01); B29L 2031/7164 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2307/518 (2013.01); B32B 2307/714 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/75 (2013.01); B32B 2435/02 (2013.01); B32B 2439/40 (2013.01); B32B 2439/80 (2013.01); Y10T 156/10 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/3154 (2015.04);
Abstract

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

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