The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Nov. 25, 2020
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
James M. Gardner, Corvallis, OR (US);
Berkeley Fisher, Corvallis, OR (US);
Daryl E Anderson, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 29/393 (2006.01); G01L 1/18 (2006.01); G01L 1/22 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04563 (2013.01); B41J 2/04508 (2013.01); B41J 2/04586 (2013.01); B41J 2/14153 (2013.01); B41J 29/393 (2013.01); G01L 1/18 (2013.01); G01L 1/22 (2013.01);
Abstract
A die may include a plurality of fluid pumps, at least one strain gauge sensor to sense a strain in the die, and at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain.