The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jan. 19, 2018
Applicant:

Precision Valve & Automation, Inc., Halfmoon, NY (US);

Inventors:

Andrew John Nally, Malta, NY (US);

Jonathan Neal Urquhart, Saratoga Springs, NY (US);

Jeffrey James VanNorden, Clifton Park, NY (US);

William Edward Berkheiser, III, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B32B 37/14 (2006.01); B32B 17/10 (2006.01); B32B 37/12 (2006.01); B32B 38/18 (2006.01); B05C 5/02 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); B32B 17/10807 (2013.01); B32B 37/12 (2013.01); B32B 38/18 (2013.01); B05C 5/0279 (2013.01); B32B 2551/00 (2013.01); Y10T 156/10 (2015.01); Y10T 156/17 (2015.01);
Abstract

An optical bonding machine is provided that includes a robotic placement machine having a Z axis actuator coupled to a first end of a base portion of the robotic placement machine, the Z axis actuator capable of moving up and down a Z axis, and a pick and place plate operably connected to the Z axis actuator, and a vertically oriented adhesive application valve configured to apply an amount of adhesive onto an underside of a substrate, the underside of the substrate facing down when the amount of adhesive is applied, wherein the pick-and-place plate of the robotic placement machine manipulates the substrate within the optical bonding machine such that the substrate receives the amount of adhesive prior to being optically bonded to an other substrate; wherein a movement of the robotic placement machine is controllable over at least 3 axes.


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