The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jun. 24, 2020
Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventors:

Tukaram K. Hatwar, Penfield, NY (US);

Rebecca Borrelli, Rochester, NY (US);

Steve Oliver, Webster, NY (US);

Assignee:

Eagle Technology, LLC, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B29C 64/314 (2017.01); B22F 3/10 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B22F 3/1035 (2013.01); B29C 64/314 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

The present invention is directed toward an additive manufacturing method for manufacturing silica-based structures that have a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion. The structure may be constructed with a powder mixture that contains at least a first set of silica-based particles that are spherical and that have a first size, and a second set of submicron silica-based particles that are jagged, spherical, or both jagged and spherical. The silica-based powder mixture may be combined with a surfactant in order to create a slurry that can be used to create a 3D printed structure that has a low linear cure shrinkage percentage and an ultra-low coefficient of thermal expansion.


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