The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Jul. 08, 2020
Applicant:

Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;

Inventors:

Atsushi Murata, Nagano-ken, JP;

Tomonori Karasawa, Nagano-ken, JP;

Hirofumi Murata, Nagano-ken, JP;

Hozumi Yoda, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/17 (2006.01); B29C 45/68 (2006.01);
U.S. Cl.
CPC ...
B29C 45/68 (2013.01); B29C 2045/686 (2013.01);
Abstract

An injection molding apparatus has a mold clamping device that includes a traction platen disposed below a pressure-receiving platen, a movable platen disposed above the pressure-receiving platen and configured to be moved up and down by a mold opening and closing mechanism, and tie bars extending downward from the movable platen and penetrating the pressure-receiving platen and the traction platen. The mold clamping device is configured to clamp molds disposed between the pressure-receiving platen and the movable platen. Each tie bar has a tooth portion at its lower end that engages with a tooth portion of a half nut connected to an underside of the traction plate. An injection device arranged on the movable platen includes a heating cylinder having a screw for feeding resin material through a nozzle to an upper one of the molds, and a purging cover encloses a space between the lower end portion of the heating cylinder and the movable platen.


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