The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Aug. 09, 2021
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

David Charles Bogdan, Jr., Charlton, NY (US);

Jason Harris Karp, Niskayuna, NY (US);

William Thomas Carter, Galway, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B23P 6/00 (2006.01); H01S 5/40 (2006.01); G02B 6/42 (2006.01); B29C 64/153 (2017.01); B28B 1/00 (2006.01); C03B 19/01 (2006.01); F01D 5/00 (2006.01); B23K 26/342 (2014.01); B23K 26/10 (2006.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); B29C 64/277 (2017.01); B33Y 80/00 (2015.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); B23K 103/00 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23P 6/007 (2013.01); B23K 26/0006 (2013.01); B23K 26/0604 (2013.01); B23K 26/0622 (2015.10); B23K 26/0626 (2013.01); B23K 26/0823 (2013.01); B23K 26/0869 (2013.01); B23K 26/103 (2013.01); B23K 26/342 (2015.10); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B29C 64/277 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); C03B 19/01 (2013.01); F01D 5/005 (2013.01); G02B 6/425 (2013.01); G02B 6/4296 (2013.01); H01S 5/4081 (2013.01); B23K 2103/26 (2018.08); B23K 2103/42 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.


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