The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Apr. 18, 2018
Applicant:
Via Mechanics, Ltd., Kanagawa, JP;
Inventors:
Kaori Tateishi, Kanagawa, JP;
Yasushi Ito, Kanagawa, JP;
Assignee:
VIA MECHANICS, LTD., Kanagawa-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/386 (2014.01); B23K 26/40 (2014.01); C03C 15/00 (2006.01); C03C 23/00 (2006.01); B23K 26/18 (2006.01); B23K 26/384 (2014.01); B23K 26/0622 (2014.01); B23K 26/402 (2014.01); B23K 26/382 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/386 (2013.01); B23K 26/0622 (2015.10); B23K 26/18 (2013.01); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); C03C 15/00 (2013.01); C03C 23/0025 (2013.01); B23K 2103/54 (2018.08);
Abstract
Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.