The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Feb. 09, 2021
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Christine A. Frysz, Orchard Park, NY (US);

Robert A. Stevenson, Canyon Country, CA (US);

Jason Woods, Carson City, NV (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); H01R 13/26 (2006.01); H01R 4/58 (2006.01); A61N 1/378 (2006.01); H01R 13/52 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/378 (2013.01); H01R 4/58 (2013.01); H01R 13/26 (2013.01); H01R 13/5221 (2013.01); H01R 13/5224 (2013.01); A61N 1/37512 (2017.08); H01R 2201/12 (2013.01); H03H 2001/0014 (2013.01); H03H 2001/0021 (2013.01); H03H 2001/0042 (2013.01);
Abstract

A feedthrough for an AIMD is described. The feedthrough includes an electrically conductive ferrule having a ferrule sidewall defining a ferrule opening. The ferrule sidewall has a height. At least one recessed pocket has a depth extending part-way through the height of the ferrule. An oxide-resistant pocket-pad is nested in the recessed pocket. An electrical connection material is supported on the pocket-pad for making an oxide-resistant electrical connection to the ferrule. An insulator is hermetically sealed to the ferrule in the ferrule opening. At least one active via hole extends through the insulator with an active conductive pathway residing in and hermetically sealed to the insulator in the active via hole.


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