The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Oct. 27, 2022
Applicant:

The Government of the United States of America, As Represented BY the Secretary of the Navy, Arlington, VA (US);

Inventors:

Joseph C. Prestigiacomo, Springfield, VA (US);

Raymond C. Y. Auyeung, Alexandria, VA (US);

Michael S. Osofsky, Clarksville, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H10N 60/20 (2023.01); H10N 60/01 (2023.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 35/02 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
H10N 60/203 (2023.02); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 35/0222 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 24/03 (2013.01); H10N 60/01 (2023.02); H10N 60/0801 (2023.02); B23K 35/264 (2013.01); B23K 2101/42 (2018.08); H01L 2221/68309 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/05109 (2013.01); H01L 2224/05113 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01);
Abstract

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.


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