The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Apr. 28, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Ji Hun Ryu, Yongin-si, KR;

Jin Oh Kwag, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 5/00 (2006.01); H10K 59/60 (2023.01); G06F 3/041 (2006.01); G06V 40/13 (2022.01); H10K 50/86 (2023.01); H10K 59/122 (2023.01); H10K 59/35 (2023.01);
U.S. Cl.
CPC ...
H10K 59/60 (2023.02); G06F 3/0412 (2013.01); G06V 40/1318 (2022.01); H10K 50/865 (2023.02); H10K 59/122 (2023.02); H10K 59/351 (2023.02);
Abstract

A fingerprint sensor includes: a substrate; a circuit element layer on a first surface of the substrate and including a plurality of conductive layers; a light emitting element layer on the circuit element layer and including light emitting elements and a light shielding layer; and a light sensor layer on a second surface of the substrate and including light sensors, wherein the light shielding layer includes contact holes exposing first electrodes of the light emitting elements, and first opening portions exposing a portion of the circuit element layer, and the circuit element layer includes second opening portions formed in the plurality of conductive layers and includes a light transmission hole of which at least a portion overlaps the first opening portions.


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