The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Sep. 22, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Toshikazu Takagi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 3/46 (2006.01); H05K 3/32 (2006.01); H02M 7/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H02M 7/003 (2013.01); H05K 1/0215 (2013.01); H05K 3/32 (2013.01); H05K 3/46 (2013.01); H05K 7/20436 (2013.01); H01L 2023/4018 (2013.01); H05K 2201/10409 (2013.01);
Abstract

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.


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