The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Apr. 30, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Changjoon Lee, Suwon-si, KR;
Seongho Son, Suwon-si, KR;
Jongsung Lee, Suwon-si, KR;
Youngki Jung, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); G02B 1/14 (2015.01); H01L 25/075 (2006.01); G09F 9/302 (2006.01); G09G 3/32 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G02B 1/14 (2015.01); G09F 9/3026 (2013.01); G09G 3/32 (2013.01); H01L 25/0753 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01);
Abstract
A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.