The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Aug. 12, 2020
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Hung-Jui Chen, New Taipei, TW;

Po-Jui Lin, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 33/62 (2010.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01); H01L 31/0203 (2014.01); H01L 33/52 (2010.01); H01L 25/16 (2023.01); H01L 31/173 (2006.01); A61B 5/024 (2006.01);
U.S. Cl.
CPC ...
H01L 31/12 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02164 (2013.01); H01L 31/173 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); A61B 5/02427 (2013.01); A61B 2562/0233 (2013.01); A61B 2562/185 (2013.01);
Abstract

A sensing device includes a substrate, two chips, and a shielding structure. The two chips are respectively defined as an emitting chip and a receiving chip. The emitting chip can emit a sensing light beam, the receiving chip can receive the sensing light beam, and the two chips are fixed in position on the substrate at intervals. At least one of the chips is electrically connected to the substrate through at least one wire, and a position where the wire is connected to the substrate is located between the two chips. The shielding structure is formed on the substrate. The shielding structure is located between the two chips, and the shielding structure covers the wire and a portion of the chip connected to the wire. Compared with the conventional photo-plethysmography sensor, the sensing device has the advantage of a smaller size.


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