The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Sep. 29, 2018
Applicants:

Ordos Yuansheng Optoelectronics Co., Ltd., Inner Mongolia, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Fang Yan, Beijing, CN;

Dawei Shi, Beijing, CN;

Lei Yao, Beijing, CN;

Zifeng Wang, Beijing, CN;

Wentao Wang, Beijing, CN;

Lu Yang, Beijing, CN;

Haifeng Xu, Beijing, CN;

Xiaowen Si, Beijing, CN;

Jinfeng Wang, Beijing, CN;

Lei Yan, Beijing, CN;

Jinjin Xue, Beijing, CN;

Lin Hou, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/1343 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/134345 (2021.01); G02F 1/136222 (2021.01); H01L 27/1259 (2013.01);
Abstract

An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes: a base substrate; a first electrode located on the base substrate and including a pad portion, the pad portion including a first surface and a second surface, the second surface being closer to the base substrate than the first surface; a first insulation layer located on the first electrode and including a first via hole; a second insulation layer located on the first insulation layer and including a second via hole; and a second electrode located on the second insulation layer; the second electrode is electrically connected with the first electrode at the pad portion through the first via hole and the second via hole, and an orthographic projection of the pad portion on the base substrate falls within an orthographic projection of the second via hole on the base substrate.


Find Patent Forward Citations

Loading…