The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Sep. 30, 2019
Rohm Co., Ltd., Kyoto, JP;
Kazunori Fuji, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
A semiconductor device Adisclosed includes: a semiconductor elementhaving an element obverse face and element reverse face that face oppositely in a thickness direction z, with an obverse-face electrode(first electrode) and a reverse-face electroderespectively formed on the element obverse face and the element reverse face; a conductive memberA opposing the element reverse face and conductively bonded to the reverse-face electrode; a conductive memberB spaced apart from the conductive memberA and electrically connected to the obverse-face electrode; and a lead memberhaving a lead obverse facefacing in the same direction as the element obverse face and connecting the obverse-face electrodeand the conductive memberB. The lead member, bonded to the obverse-face electrodevia a lead bonding layer, includes a protrusionprotruding in the thickness direction z from the lead obverse face. The protrusionoverlaps with the obverse-face electrodeas viewed in the thickness direction z. This configuration suppresses deformation of the connecting member to be pressed during sintering treatment.