The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Jul. 09, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Seiya Sugimachi, Tokyo, JP;
Kazufumi Oki, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H02P 29/68 (2016.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H02P 27/08 (2013.01); H02P 29/68 (2016.02);
Abstract
A semiconductor module includes: a switching device including a gate pad; an output unit including an output pad connected with the gate pad of the switching device through a wire and outputting a drive signal from the output pad to the switching device; a temperature protection circuit detecting temperature and performing protection operation; and a heat conduction pattern connected with the output pad, extending from the output pad toward the temperature protection circuit, and conducting heat generated at the switching device to the temperature protection circuit.