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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11710678 B1

PDFFull Text
Date of Patent:
Jul. 25, 2023

Filed:

Mar. 29, 2019

Combined architecture for cooling devices

Applicant:

Frore Systems Inc., Los Altos, CA (US);

Inventors:

Suryaprakash Ganti, Los Altos, CA (US);

Seshagiri Rao Madhavapeddy, La Jolla, CA (US);

Leonard Eugene Fennell, San Jose, CA (US);

Vikram Mukundan, San Ramon, CA (US);

Assignee:

Frore Systems Inc., San Jose, CA (US);

Attorney:

Van Pelt, Yi & James LLP

Primary Examiner:

Miguel A Diaz

Int. Cl.
CPC ...
F25B 21/02 (2006.01); H01L 41/00 (2013.01); F04B 17/00 (2006.01); H01L 23/473 (2006.01); F04B 53/10 (2006.01); F04B 43/04 (2006.01); F04B 45/047 (2006.01); B06B 1/06 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H05K 7/20 (2006.01); F04D 33/00 (2006.01); H04M 1/02 (2006.01); F04B 43/09 (2006.01); H01L 23/46 (2006.01); H01L 23/42 (2006.01); F04B 45/04 (2006.01); H10N 30/00 (2023.01); H10N 30/20 (2023.01); H10N 30/80 (2023.01); H10N 35/80 (2023.01);
U.S. Cl.
CPC ...
H01L 23/4735 (2013.01); B06B 1/06 (2013.01); F04B 17/003 (2013.01); F04B 43/04 (2013.01); F04B 43/046 (2013.01); F04B 43/095 (2013.01); F04B 45/043 (2013.01); F04B 45/047 (2013.01); F04B 53/1077 (2013.01); F04D 33/00 (2013.01); F25B 21/02 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); H01L 23/4336 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H04M 1/0202 (2013.01); H05K 7/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/2039 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H10N 30/00 (2023.02); H10N 30/20 (2023.02); H10N 30/204 (2023.02); H10N 30/2047 (2023.02); H10N 30/80 (2023.02); H10N 35/80 (2023.02); F25B 2321/023 (2013.01); F25B 2321/025 (2013.01); F25B 2321/0212 (2013.01); F25B 2321/0252 (2013.01);
Abstract

A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

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