The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Dec. 13, 2018
Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventors:

Eiichi Nomura, Tatsuno, JP;

Yutaka Miyamoto, Tatsuno, JP;

Takayuki Hashimoto, Tatsuno, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H05K 3/46 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/12 (2013.01); H01L 23/31 (2013.01); H03H 3/08 (2013.01); H03H 9/25 (2013.01); H05K 1/144 (2013.01); H05K 3/4632 (2013.01); H05K 2203/068 (2013.01); H05K 2203/1147 (2013.01);
Abstract

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.


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