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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11710595 B1

PDFFull Text
Date of Patent:
Jul. 25, 2023

Filed:

Mar. 04, 2020

Magnetic component structure with thermal conductive filler and method of fabricating the same

Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Ting Lai, Hsinchu, TW;

Jen-Chuan Hsiao, Hsinchu, TW;

Yuan-Ming Chang, Hsinchu, TW;

Hsieh-Shen Hsieh, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorney:

Winston Hsu

Primary Examiner:

Shawki S Ismail

Assistant Examiner:

Kazi S Hossain

Int. Cl.
CPC ...
H01F 27/22 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 41/04 (2006.01); H01F 1/147 (2006.01); H01F 1/34 (2006.01); H01F 41/02 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 1/14708 (2013.01); H01F 1/14766 (2013.01); H01F 1/344 (2013.01); H01F 27/02 (2013.01); H01F 27/24 (2013.01); H01F 27/28 (2013.01); H01F 27/325 (2013.01); H01F 41/0246 (2013.01); H01F 41/04 (2013.01);
Abstract

An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.

Find Patent Forward Citations

Lai, Yi-Ting. (2023). Magnetic component structure with thermal conductive filler and method of fabricating the same (U.S. Patent No. 11710595). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11710595

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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