The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Mar. 04, 2020
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Yi-Ting Lai, Hsinchu, TW;
Jen-Chuan Hsiao, Hsinchu, TW;
Yuan-Ming Chang, Hsinchu, TW;
Hsieh-Shen Hsieh, Hsinchu, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/22 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 41/04 (2006.01); H01F 1/147 (2006.01); H01F 1/34 (2006.01); H01F 41/02 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 1/14708 (2013.01); H01F 1/14766 (2013.01); H01F 1/344 (2013.01); H01F 27/02 (2013.01); H01F 27/24 (2013.01); H01F 27/28 (2013.01); H01F 27/325 (2013.01); H01F 41/0246 (2013.01); H01F 41/04 (2013.01);
Abstract
An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.