The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Jun. 14, 2021
Applicant:

Tokin Corporation, Sendai, JP;

Inventors:

Keitaro Tanno, Tokyo, JP;

Shun Mikoshiba, Tokyo, JP;

Kenichi Chatani, Tokyo, JP;

Assignee:

TOKIN CORPORATION, Miyagi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 1/28 (2006.01); H01F 41/02 (2006.01); B29C 51/00 (2006.01); B29C 51/02 (2006.01); B29L 7/00 (2006.01); B29K 33/00 (2006.01); B29K 505/00 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
H01F 1/28 (2013.01); B29C 51/002 (2013.01); B29C 51/02 (2013.01); H01F 41/02 (2013.01); B29K 2033/08 (2013.01); B29K 2063/00 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0008 (2013.01); B29L 2007/002 (2013.01);
Abstract

A forming method of a composite magnetic sheet. The forming method comprises a preparing step, a forming step and a heat-treating step. In the preparing step, magnetic slurry is prepared by mixing at least a soft magnetic powder having a flat shape, a first resin having a solid component and a second resin having a solid component, weight loss of the solid component of the first resin being 4.0% or less at 220° C., weight loss of the solid component of the second resin being 5.0% or more at 220° C. In the forming step, the magnetic slurry is formed into an intermediate body having a sheet-like shape. In the heat-treating step, the intermediate body is heat-treated at a heat-treatment temperature between 220° C. and 400° C. (both inclusive).


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