The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Sep. 23, 2020
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Markham, CA;
Greg Sadowski, Boxborough, MA (US);
Sriram Sundaram, Austin, TX (US);
Stephen Kushnir, Markham, CA;
William C. Brantley, Austin, TX (US);
Michael J. Schulte, Austin, TX (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
ATI TECHNOLOGIES ULC, Markham, CA;
Abstract
A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.