The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Dec. 16, 2021
Harbin Institute of Technology, Harbin, CN;
HARBIN INSTITUTE OF TECHNOLOGY, Harbin, CN;
Abstract
Disclosed are a linkage device, a transceiver module and a plane stress field measuring device and method capable of achieving synchronous adjustment of distance and angle, and relates to the field of ultrasonic non-destructive testing. The existing technical means for measuring plane stress in the field of ultrasonic testing has the shortcomings that the same testing is only applicable for single materials and the deflection angles of transmitting and receiving transducers are inconsistent. In the application, the linkage device designed by comprising a distance adjusting screw, an angle adjusting screw, a left connecting rod, a right connecting rod, a shaft column and a column lock is adopted, and based on the linkage device, the transceiver module designed by comprising a receiving end wedge, a receiving probe, a transmitting end wedge and a transmitting probe is additionally arranged; based on the transceiver module, the measuring device designed by comprising a pulse transmitting device, an amplifying device and a data acquisition device is additionally arranged, and the stress measuring method applicable for the stress measuring device is provided; and the distance and deflection angle between the receiving probe and the transmitting probe of the detection are adjusted according to a tested part. The application applies to stress measurement in the manufacturing process of mechanical components.