The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Sep. 11, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Yasuhiro Shimizu, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 75/36 (2006.01); B65B 9/04 (2006.01); B65B 15/04 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
B65D 75/367 (2013.01); B65B 9/04 (2013.01); B65B 15/04 (2013.01); H05K 13/0084 (2013.01); H05K 13/0419 (2018.08);
Abstract

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.


Find Patent Forward Citations

Loading…