The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

May. 20, 2022
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Yasuda, Tokyo, JP;

Rikiya Yamashita, Tokyo, JP;

Takanori Yamashita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 55/12 (2006.01); B32B 27/36 (2006.01); B65D 65/40 (2006.01); H01M 50/124 (2021.01); H01M 50/129 (2021.01); H01M 50/133 (2021.01); H01M 50/121 (2021.01); H01M 50/131 (2021.01); B32B 7/12 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); H01M 50/14 (2021.01); H01M 50/119 (2021.01); H01M 50/117 (2021.01); H01M 50/198 (2021.01); H01M 50/126 (2021.01); H01M 50/197 (2021.01); H01M 50/19 (2021.01); H01M 50/10 (2021.01); H01M 50/145 (2021.01); H01M 50/116 (2021.01);
U.S. Cl.
CPC ...
B29C 55/12 (2013.01); B32B 27/36 (2013.01); B65D 65/40 (2013.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/129 (2021.01); H01M 50/133 (2021.01); B32B 7/12 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2307/518 (2013.01); B32B 2367/00 (2013.01); B32B 2457/10 (2013.01); H01M 50/10 (2021.01); H01M 50/116 (2021.01); H01M 50/117 (2021.01); H01M 50/119 (2021.01); H01M 50/126 (2021.01); H01M 50/131 (2021.01); H01M 50/14 (2021.01); H01M 50/145 (2021.01); H01M 50/19 (2021.01); H01M 50/197 (2021.01); H01M 50/198 (2021.01); Y10T 428/31678 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31786 (2015.04);
Abstract

A technology for improving molding properties while minimizing curling after molding in a battery packaging material comprising a laminate that is provided with a barrier layer, a heat-sealable resin layer positioned on one surface side of the barrier layer, and a polyester film positioned on the other surface side of the barrier layer. This battery packaging material is configured from at least a laminate provided with a barrier layer, a heat-sealable resin layer positioned on one surface side of the barrier layer, and a polyester film positioned on the other surface side of the barrier layer. The birefringence of the polyester film is in the range of 0.016-0.056.


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