The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Dec. 26, 2019
Honda Motor Co., Ltd., Tokyo, JP;
Yasushi Arahata, Tochigi, JP;
Chiriki Watanabe, Tochigi, JP;
Yushi Shinno, Tochigi, JP;
Koji Watanabe, Tochigi, JP;
Yusuke Takamura, Tochigi, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
Abstract
A resin molding systemcomprises a gripping deviceprovided with a gripping framefor gripping a resin sheet material, a heating device for heating the resin sheet materialand a molding device for clamping a lower dieand an upper die, and affixing the resin sheet materialto a substrate. The molding device is provided with: a lowering device for lowering the gripping deviceand causing the resin sheet materialgripped by the gripping frameto approach the lower die; and a pair of bent postswhich are provided on both Y-direction sides of the lower die, and which come in contact with portions of the gripping framewhen the gripping deviceis lowered, and which convexly bend the gripping frameupward as viewed from the side along the Y-direction.