The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Sep. 11, 2019
Applicant:

Zeon Corporation, Tokyo, JP;

Inventors:

Takeshi Hirata, Tokyo, JP;

Nozomi Yabuki, Tokyo, JP;

Assignee:

ZEON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 13/00 (2006.01); B05D 7/00 (2006.01); B32B 5/16 (2006.01); B01J 13/04 (2006.01); B01J 13/14 (2006.01); B01J 13/22 (2006.01); C08F 2/18 (2006.01); C08F 12/36 (2006.01); C08F 20/06 (2006.01); C08F 20/14 (2006.01); C08F 20/40 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B01J 13/04 (2013.01); B01J 13/14 (2013.01); B01J 13/22 (2013.01); C08F 2/18 (2013.01); C08F 12/36 (2013.01); C08F 20/06 (2013.01); C08F 20/14 (2013.01); C08F 20/40 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.


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