The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Mar. 11, 2019
Applicant:
Endotronix, Inc., Lisle, IL (US);
Inventors:
Harry Rowland, Plainfield, IL (US);
Michael Nagy, Lombard, IL (US);
Balamurugan Sundaram, Dunlap, IL (US);
Suresh Sundaram, Dunlap, IL (US);
Assignee:
ENDOTRONIX, INC., Lisle, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); A61B 5/00 (2006.01); A61B 5/0215 (2006.01); A61B 5/07 (2006.01); G01L 19/06 (2006.01); G01L 9/00 (2006.01); H05K 9/00 (2006.01); B81B 3/00 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/686 (2013.01); A61B 5/0215 (2013.01); A61B 5/076 (2013.01); B81B 3/0035 (2013.01); B81C 1/00261 (2013.01); G01L 9/0042 (2013.01); G01L 19/0038 (2013.01); G01L 19/0618 (2013.01); H05K 9/0024 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/168 (2013.01); B81B 2201/0264 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/019 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/075 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10371 (2013.01);
Abstract
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.