The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Mar. 08, 2021
Applicant:

St. Jude Medical International Holding S.à R.l., Luxembourg, LU;

Inventors:

Terry Sterrett, Huntington Beach, CA (US);

Allyn Jensrud, Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 18/14 (2006.01); C25D 5/56 (2006.01); C25D 5/02 (2006.01); A61B 5/287 (2021.01); A61B 34/20 (2016.01);
U.S. Cl.
CPC ...
A61B 5/6852 (2013.01); A61B 5/287 (2021.01); A61B 18/1492 (2013.01); C25D 5/022 (2013.01); C25D 5/56 (2013.01); A61B 2034/2051 (2016.02); A61B 2562/04 (2013.01); A61B 2562/06 (2013.01); A61B 2562/125 (2013.01);
Abstract

A sensor for a medical device including a plurality of sensor segments. Each of the plurality of sensor segments can include a layer of magnetically-permeable material and a layer of electrically-conductive material disposed on the layer of magnetically-permeable material. In an example, the layer of magnetically-permeable material can be arranged in a partially-annular shape. The sensor segments can include an electrical connection formation that extends transverse to the layers of magnetically-permeable material and electrically-conductive material. The electrical connection formation can be electrically coupled with the layer of electrically-conductive material. The plurality of sensor segments can be electrically coupled with each other through an electrical coupling of the respective layer of electrically-conductive material of each sensor segment with the electrical connection formation of another sensor segment.


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