IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11705624 B1

PDFFull Text
Date of Patent:
Jul. 18, 2023

Filed:

Nov. 29, 2018

Wiring board and method for manufacturing wiring board

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Koichi Suzuki, Tokyo-to, JP;

Seiji Take, Tokyo-to, JP;

Daisuke Matsuura, Tokyo-to, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 3/12 (2006.01); H05K 3/18 (2006.01); H05K 7/04 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01L 21/70 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/522 (2006.01); H01L 23/535 (2006.01); H01L 27/00 (2006.01); H01L 27/02 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 27/115 (2017.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/36 (2013.01); H05K 1/0274 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Find Patent Forward Citations

Loading…