The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Mar. 03, 2021
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Atsushi Hosokawa, Yokohama Kanagawa, JP;

Yasuhisa Shintoku, Fujisawa Kanagawa, JP;

Yasukazu Noine, Chigasaki Kanagawa, JP;

Yoshiharu Katayama, Oita Oita, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 25/16 (2023.01); H01L 23/64 (2006.01); H01L 23/495 (2006.01); H01L 25/18 (2023.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/49589 (2013.01); H01L 23/645 (2013.01); H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/73207 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes an integrated circuit (IC) chip and a silicon capacitor. The IC chip has a first terminal and a second terminal on a first surface. The silicon capacitor has a first electrode and a second electrode on a second surface facing the first surface. The first electrode is electrically connected to the first terminal through a first conductive member, and the second electrode is electrically connected to the second terminal through a second conductive member.


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