The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Aug. 31, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Shigeto Fujita, Tokyo, JP;
Tetsuya Matsuda, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A spring electrode for a press-pack power semiconductor module includes a first electrode in contact with a power semiconductor chip, a second electrode arranged to face the first electrode, and a pressure pad which connects the first electrode and the second electrode and has flexibility in a normal direction of opposing surfaces of the first electrode and the second electrode. The opposing surfaces of the first electrode and the second electrode can be polygons of a pentagon or more, the pressure pad can be a cylindrical conductor or a plurality of wire conductors, and sides of the opposing surface of the first electrode and sides of the opposing surface of the second electrode corresponding to these sides are connected in parallel by the pressure pad.