The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Apr. 07, 2022
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Kun Young Lee, Seoul, KR;
Tae Kyung Kim, Cheongju-si Chungcheongbuk-do, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 25/00 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 22/14 (2013.01); H01L 25/50 (2013.01); H01L 28/60 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A method of manufacturing a semiconductor memory device includes processing a first substrate including a first align mark and a first structure, processing a second substrate including a second align mark and a second structure, orientating the first substrate and the second substrate such that the first structure and the second structure face each other, and controlling alignment between the first structure and the second structure by using the first align mark and the second align mark to couple the first structure with the second structure.