The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Apr. 26, 2022
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Keisuke Fukae, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/33 (2006.01); H01G 4/30 (2006.01); H01G 4/252 (2006.01); H01G 4/012 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01G 4/012 (2013.01); H01G 4/252 (2013.01); H01G 4/306 (2013.01); H01G 4/008 (2013.01);
Abstract

A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.


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