The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
May. 19, 2020
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Miyuki Asai, Tokyo, JP;
Hokuto Eda, Tokyo, JP;
Masazumi Arata, Tokyo, JP;
Hitoshi Ohkubo, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/255 (2013.01); H01F 27/324 (2013.01); H01F 2027/2809 (2013.01);
Abstract
In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.