The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Feb. 14, 2017
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takashi Yamaguchi, Osaka, JP;

Tatsuoki Nagaishi, Osaka, JP;

Masaya Konishi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/06 (2006.01); H01F 6/02 (2006.01); H01F 6/06 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01B 12/06 (2013.01); H01F 6/02 (2013.01); H01F 6/06 (2013.01); H01F 41/048 (2013.01); H01F 41/122 (2013.01);
Abstract

A superconducting wire according to one embodiment of the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; and respective coating layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective coating layers are disposed on the first surface and the fourth surface. Adhesion strength between the substrate and the coating layer disposed on the first surface is lower than adhesion strength between the superconducting layer and the coating layer disposed on the fourth surface.


Find Patent Forward Citations

Loading…