The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Aug. 20, 2020
Applicant:

Alibaba Group Holding Limited, Grand Cayman, KY;

Inventors:

Lide Duan, Sunnyvale, CA (US);

Wei Han, Cupertino, CA (US);

Yuhao Wang, Sunnyvale, CA (US);

Fei Xue, Sunnyvale, CA (US);

Yuanwei Fang, Sunnyvale, CA (US);

Hongzhong Zheng, Los Gatos, CA (US);

Assignee:

Alibaba Group Holding Limited, Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/16 (2006.01); G06F 13/40 (2006.01); G06N 20/00 (2019.01); H01L 25/18 (2023.01); H01L 25/065 (2023.01); G06F 13/16 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); G06F 13/1668 (2013.01); G06N 20/00 (2019.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01);
Abstract

A system-in-package architecture in accordance with aspects includes a logic die and one or more memory dice coupled together in a three-dimensional slack. The logic die can include one or more global building blocks and a plurality of local building blocks. The number of local building blocks can be scalable. The local building blocks can include a plurality of engines and memory controllers. The memory controllers can be configured to directly couple one or more of the engines to the one or more memory dice. The number and type of local building blocks, and the number and types of engines and memory controllers can be scalable.


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