The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Jul. 25, 2021
Applicant:

Vmware, Inc., Palo Alto, CA (US);

Inventor:

Amit Singh, Woodside, CA (US);

Assignee:

VMWARE, INC., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 8/18 (2009.01); H04W 8/20 (2009.01); G06F 9/455 (2018.01); G06F 30/331 (2020.01); G06F 9/38 (2018.01); G06F 9/48 (2006.01); G06F 9/54 (2006.01); G06F 9/4401 (2018.01); H04W 40/24 (2009.01); H04L 69/324 (2022.01); G06F 8/60 (2018.01); H04W 24/02 (2009.01); H04L 41/122 (2022.01); H04L 41/40 (2022.01); G06F 11/34 (2006.01); H04W 28/16 (2009.01); H04W 28/086 (2023.01); H04L 43/10 (2022.01); H04W 48/14 (2009.01); H04W 12/037 (2021.01); H04W 12/08 (2021.01); H04W 72/0453 (2023.01); G06N 20/00 (2019.01); H04B 7/0452 (2017.01); H04W 72/044 (2023.01); H04W 72/20 (2023.01); H04W 72/29 (2023.01); H04W 72/51 (2023.01); H04W 72/52 (2023.01); H04W 36/10 (2009.01); H04W 84/04 (2009.01);
U.S. Cl.
CPC ...
G06F 9/45558 (2013.01); G06F 8/60 (2013.01); G06F 9/3877 (2013.01); G06F 9/4411 (2013.01); G06F 9/45533 (2013.01); G06F 9/45545 (2013.01); G06F 9/4881 (2013.01); G06F 9/541 (2013.01); G06F 9/544 (2013.01); G06F 9/546 (2013.01); G06F 11/3409 (2013.01); G06F 30/331 (2020.01); G06N 20/00 (2019.01); H04B 7/0452 (2013.01); H04L 41/122 (2022.05); H04L 41/40 (2022.05); H04L 43/10 (2013.01); H04L 69/324 (2013.01); H04W 8/18 (2013.01); H04W 8/186 (2013.01); H04W 8/20 (2013.01); H04W 12/037 (2021.01); H04W 12/08 (2013.01); H04W 24/02 (2013.01); H04W 28/0819 (2020.05); H04W 28/16 (2013.01); H04W 40/246 (2013.01); H04W 48/14 (2013.01); H04W 72/046 (2013.01); H04W 72/0453 (2013.01); H04W 72/20 (2023.01); H04W 72/29 (2023.01); H04W 72/51 (2023.01); H04W 72/52 (2023.01); G06F 2009/4557 (2013.01); G06F 2009/45579 (2013.01); G06F 2009/45583 (2013.01); G06F 2009/45595 (2013.01); H04L 2212/00 (2013.01); H04W 36/10 (2013.01); H04W 84/042 (2013.01);
Abstract

To provide a low latency near RT RIC, some embodiments separate the RIC's functions into several different components that operate on different machines (e.g., execute on VMs or Pods) operating on the same host computer or different host computers. Some embodiments also provide high speed interfaces between these machines. Some or all of these interfaces operate in non-blocking, lockless manner in order to ensure that critical near RT RIC operations (e.g., datapath processes) are not delayed due to multiple requests causing one or more components to stall. In addition, each of these RIC components also has an internal architecture that is designed to operate in a non-blocking manner so that no one process of a component can block the operation of another process of the component. All of these low latency features allow the near RT RIC to serve as a high speed IO between the E2 nodes and the xApps.


Find Patent Forward Citations

Loading…