The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Jun. 18, 2021
Applicant:

Microjet Technology Co., Ltd., Hsinchu, TW;

Inventors:

Hao-Jan Mou, Hsinchu, TW;

Ta-Wei Hsueh, Hsinchu, TW;

Yu-Tzu Chen, Hsinchu, TW;

Shou-Cheng Cheng, Hsinchu, TW;

Chi-Feng Huang, Hsinchu, TW;

Yung-Lung Han, Hsinchu, TW;

Tsung-I Lin, Hsinchu, TW;

Wei-Ming Lee, Hsinchu, TW;

Chin-Wen Hsieh, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G06F 1/16 (2006.01); G02B 27/01 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G02B 27/0176 (2013.01); G06F 1/163 (2013.01); H05K 7/2099 (2013.01); G02B 2027/0178 (2013.01); G06F 2200/201 (2013.01);
Abstract

A wearable display device is disclosed and includes a main body and a driving module. The main body includes a frame, two temple arms and at least one monitor. The two temple arms are respectively connected with two ends of the frame, and the monitor is disposed on the frame. The driving module is disposed within the frame and includes a microprocessor, an optical display module and a heat dissipation component. The optical display module is electrically coupled with the microprocessor and configured for displaying an optical image on the at least one monitor. The heat dissipation component includes a heat dissipation base and two heat pipes. The two heat pipes are disposed on the heat dissipation base adjacent to the microprocessor. When the heat generated by the microprocessor is conducted to the heat dissipation base, the two heat pipes perform heat exchange with the heat dissipation base.


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