The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Mar. 21, 2019
Applicant:
Satco Products, Inc., Brentwood, NY (US);
Inventors:
Nobuyoshi Takeuchi, Osaka, JP;
Tsugihiro Matsuda, Kyoto, JP;
Hideo Nagai, Osaka, JP;
Masahiro Miki, Osaka, JP;
Yoshitaka Kurimoto, Osaka, JP;
Assignee:
SATCO PRODUCTS, INC., Brentwood, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/232 (2016.01); F21V 3/08 (2018.01); F21V 9/32 (2018.01); F21V 29/70 (2015.01); F21K 9/238 (2016.01); F21K 9/235 (2016.01); F21K 9/237 (2016.01); F21V 3/02 (2006.01); F21V 9/08 (2018.01); F21V 19/00 (2006.01); F21V 23/00 (2015.01); F21V 31/00 (2006.01); F21K 9/66 (2016.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); F21Y 105/10 (2016.01); F21K 9/64 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); F21V 3/00 (2015.01); H01L 33/48 (2010.01); H01L 33/32 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21K 9/235 (2016.08); F21K 9/237 (2016.08); F21K 9/238 (2016.08); F21K 9/66 (2016.08); F21V 3/02 (2013.01); F21V 3/08 (2018.02); F21V 9/08 (2013.01); F21V 9/32 (2018.02); F21V 19/005 (2013.01); F21V 23/002 (2013.01); F21V 29/70 (2015.01); F21V 31/005 (2013.01); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); F21K 9/64 (2016.08); F21V 3/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/32 (2013.01); H01L 33/48 (2013.01); H01L 33/502 (2013.01); H01L 33/647 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.