The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Sep. 27, 2019
Applicant:

Berry Global, Inc., Evansville, IN (US);

Inventors:

Ralph A. Moody, III, Mooresville, NC (US);

Mehmet Selcuk Sinangil, Mooresville, NC (US);

Assignee:

BERRY GLOBAL, INC., Evansville, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D04H 3/007 (2012.01); D04H 3/16 (2006.01); D01D 5/22 (2006.01); D01D 5/088 (2006.01); D01D 7/00 (2006.01); D04H 1/4382 (2012.01); D01F 8/06 (2006.01); D04H 1/4391 (2012.01);
U.S. Cl.
CPC ...
D04H 1/43828 (2020.05); D01D 5/088 (2013.01); D01D 5/22 (2013.01); D01D 7/00 (2013.01); D01F 8/06 (2013.01); D04H 1/4383 (2020.05); D04H 1/43832 (2020.05); D04H 1/43835 (2020.05); D04H 1/43914 (2020.05); D04H 1/43918 (2020.05); D04H 3/007 (2013.01); D04H 3/16 (2013.01); D10B 2321/021 (2013.01); D10B 2321/022 (2013.01);
Abstract

Self-crimped multi-component fibers (SMF) are provided that include (i) a first component comprising a first polymeric material, in which the first polymeric material comprises a first melt flow rate (MFR) that is less than 50 g/10 min; and (ii) a second component comprising a second polymeric material, in which the second component is different than the first component. The SMF includes one or more three-dimensional crimped portions. Also provided are nonwoven fabrics comprising a plurality of SMFs. Methods of manufacturing SMFs and nonwoven fabrics including SMFs are also provided.


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